电器与能效管理技术 ›› 2026, Vol. 0 ›› Issue (3): 10-16.doi: 10.16628/j.cnki.2095-8188.2026.03.002

• 研究与分析 • 上一篇    下一篇

线束端子压接成形过程与接触电阻的仿真分析

孙立志, 张超, 任万滨   

  1. 哈尔滨工业大学 电气工程及自动化学院, 黑龙江 哈尔滨 150001
  • 收稿日期:2025-12-12 出版日期:2026-03-30 发布日期:2026-04-20
  • 作者简介:孙立志(2000—),男,硕士研究生,研究方向为新能源电器测试分析技术。|张 超(1993—),男,助理研究员,研究方向为电接触建模与测试技术。|任万滨(1977—),男,教授,研究方向为电接触理论与应用技术。
  • 基金资助:
    国家自然科学基金项目(52407166)

Simulation Analysis of Crimping Formation Process and Contact Resistance of Wire Terminals

SUN Lizhi, ZHANG Chao, REN Wanbin   

  1. School of Electrical Engineering and Automation, Harbin Institute of Technology, Harbin 150001, China
  • Received:2025-12-12 Online:2026-03-30 Published:2026-04-20

摘要:

线束端子的压接成形质量直接决定了其电连接可靠性。提出了一种基于ABAQUS有限元软件的线束端子压接成形过程与接触电阻的仿真分析方法,获得了挤压过程与回弹过程中线束端子的应力、接触面积与模具运动位移的关系,以及压接完成后的电势云图和接触电阻。对比有限元仿真结果与实验获得的线束端子剖切截面的形状、尺寸及接触电阻数据,验证了所提仿真分析方法的可行性与准确性。

关键词: 线束端子, 压接成形, 接触电阻, 有限元仿真, 接触面积

Abstract:

The electrical connection reliability of wire terminals is directly determined by their crimping quality.A simulation analysis method for the crimping formation process and contact resistance of the wire terminal is presented based on the commercial finite element software ABAQUS.The relationship among stress,contact area and die moving displacement during crimping and springback processes is obtained, as well as the potential distribution and contact resistance data after crimping completion.The feasibility and accuracy of the proposed simulation analysis method are verified by comparing the finite element simulation results with the shape, size and contact resistance of the cross-section of wire terminals obtained from experiments.

Key words: wire terminals, crimping formation, contact resistance, finite element simulation, contact area

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