LOW VOLTAGE APPARATUS ›› 2026, Vol. 0 ›› Issue (3): 10-16.doi: 10.16628/j.cnki.2095-8188.2026.03.002

• Research & Analysis • Previous Articles     Next Articles

Simulation Analysis of Crimping Formation Process and Contact Resistance of Wire Terminals

SUN Lizhi, ZHANG Chao, REN Wanbin   

  1. School of Electrical Engineering and Automation, Harbin Institute of Technology, Harbin 150001, China
  • Received:2025-12-12 Online:2026-03-30 Published:2026-04-20

Abstract:

The electrical connection reliability of wire terminals is directly determined by their crimping quality.A simulation analysis method for the crimping formation process and contact resistance of the wire terminal is presented based on the commercial finite element software ABAQUS.The relationship among stress,contact area and die moving displacement during crimping and springback processes is obtained, as well as the potential distribution and contact resistance data after crimping completion.The feasibility and accuracy of the proposed simulation analysis method are verified by comparing the finite element simulation results with the shape, size and contact resistance of the cross-section of wire terminals obtained from experiments.

Key words: wire terminals, crimping formation, contact resistance, finite element simulation, contact area

CLC Number: