Simulation and Experimental Study on Thermal Trip of MCB

doi:10.16628/j.cnki.2095-8188.2021.04.007

Abstract

Abstract:

Thermal trip characteristic is an important index of miniature circuit breaker(MCB).Nowadays,most MCBs use bimetallic elements for thermal tripping of circuit breakers.The deformation of bimetallic sheet directly affects the operation of thermal release of MCB.It is very important to analyze the temperature rise and deformation of bimetallic sheet for the design of MCB.At the same time,20 groups of circuit breakers are tested for tripping.The experimental results are in good agreement with the simulation results.The accuracy of the simulation method is verified.

Key words: miniature circuit breaker(MCB), bimetallic sheet, tripping time, finite element simulation

CLC Number:

TM561

HU Jinli. Simulation and Experimental Study on Thermal Trip of MCB[J]. LOW VOLTAGE APPARATUS, 2021, 0(4): 34-39.

Figures/Tables 17

References 9

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部件	膨胀系数/ (10^-6·K^-1)	弹性模量/ (N·mm^-2)	电阻率/ (Ω·m)	密度/ (g·cm^-3)
主动层	18.7~20.8	≥1.78×10⁵	7.39×10^-7	8.13
被动层	0.9~1.6	≥1.36×10⁵	7.74×10^-7	8.90
中间层	12.9~14.0	≥1.78×10⁵	7.8×10^-8	8.30
焊接点	18.9	≥1.45×10⁵	1.75×10^-8	8.69

编号	最大时间/s	最小时间/s	编号	最大时间/s	最小时间/s
1	14.2	12.4	11	15.7	14.2
2	13.3	11.7	12	15.4	13.3
3	16.5	14.3	13	16.3	14.3
4	15.3	13.3	14	14.9	13.2
5	12.6	12.1	15	15.3	14.8
6	13.5	12.4	16	14.8	13.2
7	14.3	13.4	17	15.5	14.5
8	16.3	15.0	18	16.0	15.0
9	13.8	12.4	19	13.9	12.9
10	15.8	14.3	20	14.5	13.1

编号	形变量/mm	编号	形变量/mm
1	1.8	11	1.5
2	1.6	12	1.9
3	1.8	13	2.0
4	1.7	14	1.7
5	0.9	15	0.9
6	1.1	16	1.6
7	0.9	17	1.0
8	0.9	18	1.0
9	1.3	19	1.0
10	1.4	20	1.4