Simulation Study on Temperature Rise of Bimetal in MCB

doi:10.16628/j.cnki.2095-8188.2020.12.011

Abstract

Abstract:

This paper uses SolidWorks software to establish a simplified bimetal model,and uses ANSYS simulation software to simulate the simplified model,and obtains the bimetal temperature distribution and the maximum shape variables.At the same time,the corresponding bimetallic sheet is completed.And the experimental analysis of the real object is carried out.By comparing the simulation and experimental results,the maximum temperature error is 0.4k and the time to reach stable temperature rise is the same,which verifies the accuracy of the simulation method.At last,the experiment and simulation of bimetal sheet with different welding process is carried out,and the influence of different welding process on bimetal sheet temperature rise is obtained.

Key words: miniature circuit breaker (MCB), bimetal, simplified model, temperature rise simulation

CLC Number:

TM561

HU Jinli, LU Weimin, JIANG Yifei. Simulation Study on Temperature Rise of Bimetal in MCB[J]. LOW VOLTAGE APPARATUS, 2020, 0(12): 60-66.

Figures/Tables 19

References 12

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参数	双金属片
参数	主动层	被动层	焊接点
膨胀系数/K	22.8×10^-6	2.5×10^-6	18.9×10^-6
弹性模量/(N·mm^-2)	≥1.22×10⁵	≥1.22×10⁵	≥1.45×10⁵
电阻率/(Ω·m)	4.8×10^-8	4.8×10^-8	1.75×10^-8
密度/(g·cm^-3)	8.15	8.20	8.69
比热容/[J·(kg·K)^-1]	515	515	386
热导率/[W·(m·K)^-1]	144.8	144.8	400.0

序号	焊接位置	焊接气压 /(kgf·cm^-2)	预压时间 /周波	焊接热量 /kVA
1	右端平齐	7	7	60
2	中间位置	7	7	50
3	中间位置	7	6	60
4	中间位置	7	7	60
5	中间位置	6	7	60