直流小型断路器触头分离金属液桥过程研究

doi:10.16628/j.cnki.2095-8188.2026.04.001

电器与能效管理技术 ›› 2026, Vol. 0 ›› Issue (4): 1-7.doi: 10.16628/j.cnki.2095-8188.2026.04.001

• 研究与分析 • 下一篇

直流小型断路器触头分离金属液桥过程研究

薛渊, 李静, 段薇, 黄翀阳, 付思

沈阳工业大学电器新技术与应用研究所, 辽宁沈阳 110870

收稿日期:2026-01-27 出版日期:2026-04-30 发布日期:2026-05-18
作者简介:薛渊(2000—),男,硕士研究生,研究方向为小型断路器触头烧蚀。|李静(1977—),女,教授,博士,研究方向为气体放电理论及应用。|段薇(1994—),女,博士研究生,研究方向为电弧放电等离子体、直流开断技术。
基金资助:
国家自然科学基金(51407120);辽宁省科技计划联合计划(技术攻关计划项目)(2024JH2/102600224);辽宁省科技计划联合计划(自然科学基金-面上项目)(2024-MSLH-366)

Research on Metal Liquid Bridge During Contact Separation in DC Miniature Circuit Breaker

XUE Yuan, LI Jing, DUAN Wei, HUANG Chongyang, FU Si

Institute of New Electrical Technology and Application, Shenyang University of Technology, Shenyang 110870, China

Received:2026-01-27 Online:2026-04-30 Published:2026-05-18

摘要/Abstract

摘要：

为明确直流小型断路器(MCB)触头分离过程中金属液桥演化规律及双液桥诱发机理,搭建含高倍电子显微镜的慢速断开实验平台,以Cu及CuCr0.5合金为触头材料,在直流13 V负载下,系统研究16~22 A电流、0.4~1.0 mm/s分断速度下的金属液桥特性,同步采集几何参数与电压波形数据。研究表明,液桥演化呈加热熔化、稳定存在、破裂不稳定3个阶段,稳定态为圆柱形,断裂后阴极形成针尖状残余,材料从阳极定向迁移;液桥尺寸随电流增大而增加、随分断速度提升而减小,电流增加易出现双液桥且断裂易引发电弧;CuCr0.5合金触头完全抑制双液桥现象,抗液桥与抗电弧性能显著优于纯Cu。

关键词: 直流小型断路器, 金属液桥, 慢速断开, CuCr0.5合金, 双液桥

Abstract:

To clarify the evolution law of metallic liquid bridges and the inducing mechanism of double liquid bridges during the contact separation process of DC miniature circuit breakers(MCB), a slow-breaking experimental platform equipped with a high-power electron microscope is established. Taking copper(Cu) and CuCr0.5 alloy as contact materials, the characteristics of metallic liquid bridges are systematically investigated under the conditions of DC 13 V load, current ranging from 16 A to 22 A, and breaking speed between 0.4 mm/s and 1.0 mm/s, with the synchronous collection of geometric parameters and waveform data. The results show that the evolution of liquid bridges undergoes three stages:heating and melting, stable existence, and unstable rupture. The stable liquid bridge presents a cylindrical shape; after rupture, a needle-shaped residue forms on the cathode, and the material migrates directionally from the anode to the cathode. The size of liquid bridges increases with the rise of current and decreases with the increase of breaking speed. An increase in current tends to induce double liquid bridges, and their rupture is prone to trigger arc discharge. The CuCr0.5 alloy contacts completely suppress the occurrence of double liquid bridges, exhibiting significantly superior resistance to liquid bridges and arc discharge compared with pure copper contacts.

Key words: DC miniature circuit breaker, metallic liquid bridge, slow breaking, CuCr0.5 alloy, double liquid bridge

中图分类号:

TM56

薛渊, 李静, 段薇, 黄翀阳, 付思. 直流小型断路器触头分离金属液桥过程研究[J]. 电器与能效管理技术, 2026, 0(4): 1-7.

XUE Yuan, LI Jing, DUAN Wei, HUANG Chongyang, FU Si. Research on Metal Liquid Bridge During Contact Separation in DC Miniature Circuit Breaker[J]. LOW VOLTAGE APPARATUS, 2026, 0(4): 1-7.

图/表 9

图1

表1

图2

图3

图4

图5

图6

图7

图8

参考文献 23

[1]	魏波, 赵质胜, 赵明, 等. 智慧小型断路器电动操作机构的结构设计与分析[J]. 电器与能效管理技术, 2023(4):47-55.
[2]	纵月菊, 李靖, 江松, 等. 小型低压直流断路器借助永磁体提高临界负载电流开断能力的研究[J]. 电器与能效管理技术, 2024(10):26-30.
[3]	王冰青, 张森林. 基于Maxwell 3D/ADAMS的小型断路器脱扣过程仿真[J]. 电器与能效管理技术, 2024(7):74-78.
[4]	赵永秀, 王瑶, 王骑, 等. 真空断路器分断金属液桥形成的数值模拟[J]. 西安科技大学学报, 2021, 41(1):172-178.
[5]	MIYANAGA K, KAYANO Y, INOUE H. Effect of the thermal constant on temperature rise of silver palladium alloy contacts[J]. IEICE Transactions on Electronics, 2007, 90(7):1405-1411.
[6]	吴康, 王召斌, 谭力. 电磁继电器触头熔焊特性的研究综述[J]. 电器与能效管理技术, 2025(11):1-8.
[7]	成福群, 吴疆, 赵永秀, 等. 基于IEC安全火花试验装置的电感分断放电电极热-电耦合的数值研究[J]. 重庆电力高等专科学校学报, 2023, 28(6):1-7.
[8]	ISHIDA H, SUZUKI S, SONE H, et al. Formation mechanism of dark bridge between contacts with very slow opening speed[J]. IEICE Transactions on Electronics, 2006, 89(8):1136-1140.
[9]	MIYANAGA K, KAYANO Y, TAKAGI T, et al. Effect of heating value on contact diameter at low speed breaking contact[J]. IEICE Transactions on Electronics, 2009, 92(8):1020-1022.
[10]	KAYANO Y, MIYANAGA K, INOUE H. Experimental analysis of arc waveform affected by holder temperature change at slowly separation of silver-tin dioxide contacts[J]. IEICE Transactions on Electronics, 2013, 96(9):1110-1118.
[11]	李庆楠, 薄凯, 周学, 等. 低速分断条件下银基触头材料液桥特性试验研究[J]. 电器与能效管理技术, 2016(15):54-58.
[12]	REN W, WANG H, CHANG C, et al. Experimental investigation and understanding of the intermittent molten bridge phenomena and mechanism of contacts with superlow opening speed[J]. IEEE Transactions on Components,Packaging and Manufacturing Technology, 2016, 6(3):418-423. doi: 10.1109/TCPMT.2016.2530118
[13]	任万滨, 薛升俊, 赵杨杨. 新型触头材料电接触行为测试技术及试验研究[J]. 电器与能效管理技术, 2014(19):38-42.
[14]	ZHANG C, ZHENG Z, REN W, et al. Contact welding failure analysis of micro electromagnetic relays in electrical endurance experiments[J]. Journal of Failure Analysis and Prevention, 2024, 24(1):380-390. doi: 10.1007/s11668-023-01846-x
[15]	CHEN J H, CHEN S, XIE M, et al. High-speed imaging observation on molten bridges of AgNi10 electrical contact material[J]. Rare Metals, 2023, 42(1):336-345. doi: 10.1007/s12598-017-0911-z
[16]	何志鹏, 赵虎. 小型断路器电寿命试验研究[J]. 电器与能效管理技术, 2022(1):19-26.
[17]	黄靖, 李震彪, 魏江, 等. 触头电侵蚀性能影响因素概述[J]. 电器与能效管理技术, 2016(15):40-46.
[18]	种彪, 郭康生, 丁高峰, 等. 断路器铜基银合金触头回路不导通的原因分析及解决措施[J]. 电器与能效管理技术, 2018(24):43-46.
[19]	PENG S, LI J, LIU S, et al. Research on the liquid metal bridge formation process at contact separation moment of DC air circuit breaker[J]. IEEE Transactions on Plasma Science, 2024, 52(2):469-478. doi: 10.1109/TPS.2024.3357755
[20]	ZHANG C, SHEN F, KE L. Electrical contact resistance endurance of AgNi10 alloy under fretting wear:Experiment and numerical prediction[J]. Wear, 2023, 530:205009.
[21]	朱猛, 陈华, 侯玉洁. 碳纳米管直径对石蜡相变蓄热性能的影响[J]. 制冷学报, 2024, 45(2):62-67.
[22]	ZHANG H, SUN Q, SUN Z, et al. Experimental and numerical investigation of electromigration behavior of printed silver wire under high current density[J]. Journal of Electronic Packaging, 2023, 145(2):021006. doi: 10.1115/1.4055469
[23]	WANG S, SUN Y, CHEN S, et al. Effect of Y on arc breaking behavior of platinum-iridium alloy contact materials at different voltages[J]. Metals, 2023, 13(8):1394. doi: 10.3390/met13081394

直流小型断路器触头分离金属液桥过程研究

Research on Metal Liquid Bridge During Contact Separation in DC Miniature Circuit Breaker

RichHTML

PDF (PC)

可视化

摘要/Abstract

引用本文

使用本文

图/表 9

参考文献 23

相关文章 1

编辑推荐

Metrics

本文评价

参数	条件
材料	Cu
电压/V	13
电流/A	16~22
初始压力/N	90
分断速度/(mm·s^-1)	0.4
环境/温度	空气/室温