LOW VOLTAGE APPARATUS ›› 2024, Vol. 0 ›› Issue (10): 59-64.doi: 10.16628/j.cnki.2095-8188.2024.10.010

• Simulation Technology Application • Previous Articles     Next Articles

Thermal Analysis and Improvement Method Research on High Voltage Full Film Capacitor

YE Zetao1, LI Xiaojun2, ZHENG Yanwen3, HU Chenhao1, HU Sideng1   

  1. 1. College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China
    2. Ningbo Jiangbei Gofront Herong Electric Co., Ltd., Ningbo 315300, China
    3. Wolong Electric Group Co., Ltd., Shaoxing 312300, China
  • Received:2024-06-26 Online:2024-10-30 Published:2024-12-12

Abstract:

Mastering the distribution law of temperature field is an important link and technical difficulty in enhancing the stable operational performance of capacitors.Combined the structural characteristics of a certain type of high voltage full film capacitor,using the finite volume method to solve the three-dimensional temperature field distribution,the hottest temperature and corresponding position is obtained inside the complex capacitor,and its temperature parameters and distribution characteristics are studied.On this basis,in order to enhance the heat dissipation capacity of the capacitor,the improvement plans are proposed by adding new heat dissipation channels and increasing the thickness of component aluminum foil.The study indicates that the used three-dimensional temperature field analysis can accurately reflect the internal temperature characteristics of the capacitor,and the proposed improvement measures can effectively reduce the temperature of breakdown points by 33.6%.

Key words: high voltage full film capacitor, temperature field, thermal analysis, improvement measures

CLC Number: