Temperature Field Simulation of Automobile Relay Based on Fluid-Solid Coupling Method

doi:10.16628/j.cnki.2095-8188.2023.11.003

Abstract

Abstract:

The temperature rise to a certain extent restricts the miniaturization and lightweight development of automobile relays.It is particularly important to analyze the temperature field of automobile relays to improve their heat resistance. The computational fluid dynamics (CFD) simulation tool based on heat conduction differential equations, fluid motion control equations, and radiation heat transfer equations is used to propose a temperature field simulation method for automobile relays based on fluid structure coupling. Using the proposed method the temperature field distribution of a certain automobile relay under different environmental temperatures and load current levels are obtained. The proportion of heat dissipation through conduction, convection, and radiation is calculated. the heat dissipation law of the relay and coil under different environmental temperatures and load current levels is analyzed, which can lay a foundation for the subsequent thermal design and temperature rise optimization of automobile relays.

Key words: automobile relay, computational fluid dynamics (CFD), fluid-solid coupling, temperature field, heat dissipation analysis

WANG Qiya. Temperature Field Simulation of Automobile Relay Based on Fluid-Solid Coupling Method[J]. LOW VOLTAGE APPARATUS, 2023, 0(11): 17-22.

Figures/Tables 7

References 22

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