DIANQI YU NENGXIAO GUANLI JISHU ›› 2020, Vol. 586 ›› Issue (1): 46-50.doi: 10.16628/j.cnki.2095-8188.2020.01.008

• Electrical Design & Discussion • Previous Articles     Next Articles

Electrothermal Coupling Analysis and Experimental Verification of Silver Tin Plating Arc Trigger

FU Xue, QI Liansuo, ZHUANG Jinwu, YAN Ling, LU Wei   

  1. College of Electrical Engineering, Naval University of Engineering, Wuhan 430033, China
  • Received:2019-10-12 Online:2020-01-15 Published:2020-03-26

Abstract: The arc flip-flop with rated current of 500 A is taken as the research object.The mathematical modeling and analysis were carried out for the tin layer plated on the flip-flop melt with a thickness of 5μm.The simulation model of arc flip-flop was established by using the electrothermal coupling module of COMSOL platform.The simulation results show that the per-arc time of the flip-flop under 4 kA overload current is 7.5 seconds,and then the arc trigger test sample with tin plating thickness of 5 μm was made.The pre-arc characteristic test was carried out.The test results are basically consistent with the simulation results.On this basis,the pre-arc time under different tin plating thickness was studied.The simulation results show that the thinner the tin plating thickness is,the shorter the pre-arc time of the trigger is.

Key words: metallurigical effect, plating thickness, pre-arc time, resistivity

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