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Thermal Analysis of SiC MOSFET Power Module Based on Die Package
WANG Haonan, CAO Yufeng, LAI Yaokang, HU Caixia, ZHANG Hongyu, WANG Zicheng, ZHAI Guofu
LOW VOLTAGE APPARATUS . 2022, (
8
): 39 -43 . DOI: 10.16628/j.cnki.2095-8188.2022.08.006
